CL-1200 a high precision automatic solder paste printer designed
for high precision screen printing or stencil printing in SMT
2. Product Features：
a) Wide compatibility for PCB dimensions from 50mm x 50mm to 1200mm
x 340mm and PCB thickness from 0.6mm to 6mm.
b) High printing resolution:
1. High positional accuracy, repeated positioning accuracy ±0.01mm;
printing accuracy 0.03mm.
2. Support glue printing
c) Automatic control improves production efficiency, controls
quality and saves production cost:
1. Automatic stencil positioning;
2. Automatic PCB alignment;
3. Automatic adjustment of squeegee pressure;
4. Automatic printing;
5. Automatic stencil cleaning (dry-type, wet-type);
d) Adopt company independently developed suspended print head and
programmable automatic pressure adjustment system with pressure
closed-loop feedback. Support on-line real time pressure feedback
and automatic squeegee pressure balancing. Accurate pressure
control ensures perfect paste forming effect.
e) Programmable motor controls separation speed and stroke between
squeegee and stencil, to realize multi-method demold.
f) Multi-functional PCB fixed positioning system, for convenient
and accurate PCB positioning.
g) Upward and downward visual positioning.
h) Built-in image processing system;
i) Support 2D, SPC functions.
3. Applicable pitches of Components
a) SMT Components such as resistors, capacitors, inductors, diode
and triode: 0201, 0402, 0603, 0805, 1206 and other specifications.
b) IC: support SOP, TSOP, TSSOP, QFN packaging, min. pitch 0.3 mm;
support BGA, CSP packaging, min. ball 0.2 mm.
c) Printing size：80mm x 50mm ~1200 mm x 340 mm;
d) PCB thickness: 0.6 mm ~ 6 mm
e) FPC thickness: less than 0.6 mm (excluding jig)
4. Applicable PCB Types
Applicable to PCB types of LED, mobile phone, communication, LCD
TV, STB, family cinema, vehicle electronics, medical power
equipment, space flight and aviation, as well as production and
processing of general electronics products